JPH0351839U - - Google Patents
Info
- Publication number
- JPH0351839U JPH0351839U JP1989113121U JP11312189U JPH0351839U JP H0351839 U JPH0351839 U JP H0351839U JP 1989113121 U JP1989113121 U JP 1989113121U JP 11312189 U JP11312189 U JP 11312189U JP H0351839 U JPH0351839 U JP H0351839U
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- flow rate
- detection sensor
- mounter
- supply pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83053—Bonding environment
- H01L2224/83091—Under pressure
- H01L2224/83093—Transient conditions, e.g. gas-flow
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113121U JPH0351839U (en]) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989113121U JPH0351839U (en]) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351839U true JPH0351839U (en]) | 1991-05-20 |
Family
ID=31661546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989113121U Pending JPH0351839U (en]) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351839U (en]) |
-
1989
- 1989-09-26 JP JP1989113121U patent/JPH0351839U/ja active Pending
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